Overview:

FibKey8787 is a high-efficiency solvent composition for removing bleed-out and opening/de-potting cured epoxy. Instead of simply dissolving, it initiates and accelerates decomposition by causing the resin to peel and flake off layer by layer. Works best with heat. It does not discolor or corrode common metals and platings used in electronic assemblies. Fully miscible with water, disposable into aqueous waste systems, and 100% biodegradable.
When heated, FibKey8787 breaks down most epoxies. Recommended use range: 105-175°C. It also attacks some thermoplastics, including cable insulation and some thermoset coatings, but not most metals or platings in electronic assemblies; it is also an excellent solvent for removing carbonized flux. Suitable for removing epoxy bleed-out from ICs and solid-state devices.
Boiling point: 200°C.

Instructions:

Immerse parts in the remover and heat at 105-175°C for several hours.
Removes firmly bonded surface epoxy.
The remover can be reused many times.
Available in 50 ml, 500 ml and 1000 ml packaging.
(Use as-is; do not add water, which reduces effectiveness.)

TipsTips:

For easy recall, the product is named 8787, meaning "peel, peel". Easy to remember -- we hope you come back for more!

Storage

Store 8787 at room temperature (25℃) away from light; do not refrigerate.