Products Adhesives NEA Series Structural Adhesives NEA123SHGA


  NEA123SHGA UV Electronic Adhesive

Overview:
  • Low-outgassing, single-component thixotropic paste with low post-cure outgassing
  • Ideal for fast tacking, filling, sealing and bonding of components or wires
  • Bonding of HGA head gimbal assemblies, and tamper-proofing of adjustable components
  • Withstands -150°C to +150°C
NEA123SHGA Adhesive 1
NEA123SHGA Adhesive 2
NEA123SHGA Application 3
NEA123SHGA Application 4

NEA123SHGA Standard packaging - 1 oz bottle, for lab and small-batch production

NEA123SHGA is a low-outgassing, single-component thixotropic paste similar to NEA123S, curing under UV in seconds to a tough, flexible, non-tacky polymer. Compared to standard NEA123S, NEA123SHGA has lower post-cure outgassing.

NEA123SHGA cures in seconds yet remains stable without UV. It holds its shape before and after cure with no sag or distortion. This is why leading hard-drive manufacturers choose it for HGA bonding.

Sensitive to 320-390nm UV, peak at ~365nm; full cure requires ~6 J/cm². Cure time depends on thickness and UV intensity. Ideal for small-area spot curing with handheld or benchtop UV spot lamps.

Medium-pressure vapor lamps speed up cure; typically used with conveyors that isolate the operator from UV exposure.

Besides UV cure, NEA123SHGA contains a latent thermal catalyst for shadowed areas: 125°C/10 min or 80°C/3 h in a convection oven. Thermal cure completes partially UV-cured bonds. It is unnecessary if all adhesive receives adequate UV. Heating already UV-cured parts is redundant but harmless and usually reduces outgassing.

At 125°C oxygen inhibition is not an issue, but at lower temperatures air-exposed surfaces may remain tacky. Nitrogen enables tack-free low-temperature cure. Below 70°C cure is not practical. Both UV and thermal cure are exothermic; allow to cool to room temperature before testing. Excellent adhesion to glass, silica, stainless steel, aluminum, copper and common metals. Adhesion to plastics: good to fair on polypropylene, polycarbonate, acrylic, vinyl and acetal (DuPont Delrin). Bonded parts withstand -150°C to +150°C.

Technical Specifications:
Viscosity @ 25°C, 1 rpm 55,000 ~ 70,000 cps
Shore D Hardness 80
Tg 20℃
Although Norland Products adhesives cure in seconds under UV, they remain very stable without UV or excessive heat. Store in a cool, dark place. Refrigeration is not usually required but is the ideal storage method for NEA 123S HGA. If refrigerated, allow to reach room temperature before use. Avoid direct sunlight or high temperatures that may cause an exothermic reaction.
Browse or download the original English TDS and SDS for NEA123SHGA:
Download Manual (English)

Download SDS (English)
Memo:
NEA123SHGA is a higher-viscosity, low-outgassing electronic adhesive with stable performance in laser packaging applications.
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