FibKey Two-Part Epoxy Thermal Adhesive
Bond strength, unit: AL/AL kgf/cm2; thermal conductivity, unit: W/mK| Model | Description | Thermal Conductivity | Cure | Viscosity | TgTemperature | OperatingTemperature | Bond Strength | Hardness (Shore D) | Pot Life(hours) | Buy |
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| Model | Description | Thermal Conductivity | Cure | Viscosity | TgTemperature | OperatingTemperature | Bond Strength | Hardness (Shore D) | Pot Life(hours) | Buy |
|---|