Contact Product Manager:
Cerium Oxide Polishing Slurry
Introduction:
The nano-cerium oxide polishing slurry is a high-purity, low-metal-ion polishing product made from nano-cerium oxide through a special process, used for nano-level high-planarization polishing of various materials. The nano-cerium oxide polishing slurry features high polishing efficiency, good polishing effect and high precision, low impurity content, and easy cleaning after polishing. Used on cerium oxide polishing sheets or polyurethane pads, it extends the life of the polishing sheet while achieving ideal polishing results, without causing physical damage to the workpiece, and can meet customer requirements. Products in different grit sizes (10~150 nm) can be produced. The nano-cerium oxide polishing slurry has the following features: 1. Stable quality, fine grit, uniform particle distribution, moderate hardness, and not easy to scratch the polished surface; 2. Good dispersibility, improving polishing efficiency and precision.
Precautions:
1. Shake well before use to prevent sedimentation;
2. It can be diluted during use to prepare different concentrations.
Storage temperature 0~35 °C. Below 0 °C it fails due to the formation of non-redispersible gel; storage above 35 °C promotes microbial growth and accelerates gelation, shortening shelf life.
At 0~35 °C, alkaline polishing slurry can be stored for about two years, and acidic polishing slurry for about half a year.
Dosage: recommended usage 3-12%; customers can test and select the dosage based on actual conditions.
Application fields: polishing of fiber optic connectors, ceramic ferrules, silicon PLC chips, compound crystals, silicon wafers, germanium wafers, compound semiconductor materials such as gallium arsenide and indium phosphide, precision optical devices, sapphire wafers, precision optical components, gems, etc.