EP29LPSP 是双组分高性能环氧树脂胶为基的聚合物。特别适合在低温环境下的应用。 EP29LPSP 不仅在常温下是作为胶粘剂、密封胶 , 或防护涂层。在低温条件下如（ -249 ℃ ）性能也没有丝毫改变 , 而且它还能承受低温震动 ( 即室温下速冻到液态氦的温度在 5-10 个周期 ) 。它是一种无色透明 , 低黏度低温树脂胶为基的聚合物，与各种各样的物质都有很好的粘接性包括金属、玻璃、陶瓷 , 和许多不同的塑料。它的可操作时间长， 100G 的剂量工作周期在 90 ～ 120 分钟。 EP29LPSP 有优越电绝缘性和抗化学腐蚀性。虽然 EP29LPSP 在室温下也能充分固化 , 但是要取得最佳的效果 , 应在 55 ～ 74 ℃ 固化 6-8 小时。也可作为导热胶，称做 EP29LPSPAO 。

产品优点 ：

被混合后极低的黏度 ; 在固化过程中不生成其它溶剂或其它挥发成分。

常温下也能正常固化

多种固化方式 , 按需求常温或高温固化

优越的物理力学性能和抗震性 ..

优良的电气绝缘特性 .

对各种材质的物体都有很高的接合强度。

良好的耐化学性对水、各种燃料、酸、碱和盐等的都有很好的化学抵抗力。

优秀的光学性能，极高的透过率

低放热。

耐低温可达到 -249 ℃

能承受低温震动

产品属性 :

•  混合比率 , part A : part B ................................................................................................... 100/65

•  未固化涂层 粘度 , cps, 24 ℃ .................................................................................................... 400

•  混合后工作时间 ,( 100G ), 24 ℃ ................................................................................. 90-120 minutes

•  固化时间 , 室温下 .......................................................................................................... 2-3 days

•  拉伸剪切强度 (psi) Al:Al, 24 ℃ .......................................................................................................3200

•  抗拉强度 , 75°F , psi ............................................................................................................. 6500

•  拉伸比例 , 75°F , % .................................................................................................................. 12

•  拉伸系数 , 75°F , psi ........................................................................................................ >375,000

•  导热性 , 75°F , BTU?in/ft 2 ?hr?°F .................................................................................................. 0.8

•  热膨胀系数 , in/in x 10 -6 /°C ........................................................................................................ 45

•  体积电阻系数 , 75°F , ohm-cm ............................................................................................... >10 15

•  介电常数 ................................................................................................................................ 3.6

•  硬度 , Shore D .......................................................................................................................... 80

•  工作温度 , °F .................................................................................................. -269 °C ～ + 135 °C

•  保存时间 ( 24 ℃ ) .......................................................................................................... 6 months

Preparation of Compound and Bond Surfaces:

Master Bond Polymer System EP29LPSP is prepared for use by thoroughly mixing part A with part B in a 100/65 mix ratio by weight. Mixing should be done slowly to avoid trapping air although the low compound viscosity facilitates air release. The working life of a mixed 100 gm batch is 90-120 minutes. It can be further lengthened by using shallow mixing vessels or mixing smaller size batches. All bonding surfaces should be carefully cleaned, degreased and dried for obtaining maximum bond strength. Also when bonding to metal surfaces especially, chemical, etching should be employed when the bonded joints are to exhibit optimal environmental durability. Nonporous surfaces can be advantageously roughened with sand paper or emery paper for hard materials. Castings can be accomplished in rubber, plastic or metal molds after application of approximate mold releases.

Application and Assembly:

For potting and casting the EP29LPSP is readily pourable. For bonding or sealing EP29LPSP can be conveniently applied with a brush, paint roller, spatula, knife, etc. Enough mixed adhesive should be applied to obtain a final adhesive bond line thickness of 3-5 mils. This can be accomplished by coating one surface with an adhesive film 3-5 mils thick or by coating the two surfaces, each with a 1.5 to 2.5 mil thick layer of adhesive. Porous surfaces may require somewhat more adhesive to fill the voids than non-porous ones. Thicker glue lines do not increase the strength of a joint but do not necessarily give lower results as the EP29LPSP epoxy resin system does not contain any volatiles. The parts to be bonded should then be pressed together with just enough pressure to obtain and maintain intimate contact during cure.

Cure:

Master Bond Polymer System EP29LPSP can be cured at room temperature or at elevated temperatures as desired. At room temperature, Master Bond Polymer System EP29LPSP cures at room temperature within 48-72 hours. Faster cures can be realized at elevated temperatures, e.g., 6-8 hours at 130°F -165°F and 2-3 hours at 200°F . When potting, the thicker the section, the faster the rate of cure.

Handling and Storage:

All epoxy resins should be used with good ventilation, also skin contact should be minimized. Master Bond Polymer System EP29LPSP employs a low toxicity-low skin irritation "safety" hardener. To remove resin or hardener from skin, use solvent, then wash with mild soap and water. If material enters the eyes, flood with water and consult a physician. Optimum storage is at or below 75°F in closed containers. No special storage conditions are necessary. Containers should however be kept closed when not in use to avoid contamination. Cleanup of spills and equipment is readily achieved with isopropyl alcohol (90%), aromatic or ketone solvents employing proper precautions of ventilation and flammability.