Master Bond Polymer System EP65HT-3 represents a significant improvement in epoxy adhesive technology in that it features the unusual combination of ultra fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT-3 has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT-3 retains fast setup times even when mixed in relatively small masses. EP65HT-3 normally will setup in 2-4 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths approaching 3,000 psi. Service temperature range is 60°F to +400°F. EP65HT-3 offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT-3 has now been qualified to meet NASA low outgassing specifications.

EP65HT 1 bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT 1 has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT 1 is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and OEM industries.

产品优点 ：

•  Ultra-fast setting and curing even in small masses.

•  Exceptionally high heat resistance.

•  Good physical strength properties especially bonding strength.

•  Superior electrical insulation properties.

•  Excellent environmental and chemical resistance profile.

•  Now available with convenient dispensing gun.

•  NASA low outgassing certified.

产品属性 :

•  Mixing ratio, by weight, parts A to B ........................................................................... 10/1

•  Mixed viscosity 75°F , cps ............................................................................ 60,000-70,000

•  Color ............................................................................................................. dark brown

•  Cure schedule, room temperature: 40% of maximum strength developed within 2-4 minutes
100% of maximum strength developed within ............................................... 2-3 hours

Bond strength, shear, aluminum/aluminum, 75°F , psi ................................................... >2,500

•  T-peel, aluminum to aluminum, 75°F , pli ........................................................................ 2-3

•  Tensile strength, 75°F , psi ...................................................................................... >7,500

•  Tensile modulus, 75°F , psi .................................................................................... 480,000

•  Hardness, Shore D ..................................................................................................... >75

•  Dielectric constant, 75°F , (100 Hz) ............................................................................... 3.9

•  Volume resisitivity, 75°F , ohm-cm ............................................................................. >10 14

•  Service temperature range, °F .................................................................. -60°F to + 400°F

•  Shelf life at 75°F , in unopened containers .......................................................... 6 months

•  Parts A and B available in double barrel syringe with gun dispenser as well as half pint, pint, quart, gallon and 5 gallon containers.

Preparation of Adhesive and Bonding Surfaces

Master Bond Polymer System EP65HT-3 is prepared by thoroughly mixing part A with part B in a ten-to-one mix ratio by weight. It is strongly suggested that a minimum of 5 to 10 grams be mixed at a time. The working life of a 10-20 gram batch is approximately 2-4 minutes and decreases with larger masses. All bonding surfaces should be carefully cleaned, degreased and dried. Non-porous or smooth surfaces should be roughened with sandpaper or emery paper, or mechanically abraded to obtain maximum bond strength. When bonding to metal surfaces, chemical etching may be employed when the bonded joints are to exhibit optimal environmental durability. Using our new dispensing gun system eliminates the need for weighing out parts A and B and enhances consistency and reproducibility.

Adhesive Application and Assembly

Master Bond Polymer System EP65HT-3 can be conveniently applied with a syringe, spatula, knife, etc. or with the dispensing gun system mentioned above. Enough mixed adhesive should be applied to obtain a final adhesive bond line thickness of 2-6 mils, although thinner bond lines are acceptable. Porous surfaces may require somewhat more adhesive to fill the voids than non-porous ones. Thicker glue lines do not increase the strength of a joint but do not necessarily give inferior results as the EP65HT-3 system does not contain any volatiles. The parts to be bonded should then be pressed together with just enough pressure to maintain intimate contact during cure.

Cure

Master Bond Polymer System EP65HT-3 cures at room temperature. It develops 40% of its maximum bond strength within 2-4 minutes. The bond strength increases continuously for about 2-3 hours. Remove excess adhesive promptly before it hardens with a spatula. Then wipe with rag and solvent such as toluene, acetone or other EPA acceptable solvent. The thinner the layer of epoxy, the slower the rate of cure. The EP65HT-3 system does not reach its ultimate physical properties until it is completely cured.

Handling and Storage

All epoxy resins should be used with good ventilation taking care to minimize skin contact. EP65HT-3 employs a low toxicity hardener. To remove resin or hardener from skin, use solvent, then wash with mild soap and water. If material enters the eyes, flood with water and consult a physician. Optimum storage is at or below 75°F in closed containers. No special storage conditions are necessary. Containers should, however, be kept closed when not in use to avoid contamination. Cleanup of spills and equipment is readily achieved with aromatic or ketone solvents employing proper precautions of ventilation and flammability.