OPT8218-H
Overview:
- 8218-H or 353ND are widely used in fiber connector production to bond fiber to ceramic ferrules
- The original OPT8218 has been fully upgraded to this low-odor, low-allergen version
- Good handling; pot life over 4 h
- Glossy cured surface with excellent light transmission
- For substrate bonding, filling, potting and coating in fiber optics, optoelectronics, semiconductors, hybrid circuits and medical industries
- After aging, withstands -55°C to +200°C; heat/humidity resistant with good electrical insulation
Typical use: bonding fiber to ceramic ferrules when producing fiber connectors.
Good handling with over 4 h pot life, excellent flow and strong capillary action; after dispensing it self-distributes evenly in tiny holes such as ceramic ferrules, and bubbles are easy to remove.
Color changes from light yellow to amber on cure, so full cure is judged by color rather than time. Glossy cured surface with excellent light transmission; grinds off quickly with fiber polishing film.
Also suitable for semiconductor wafer bonding, MEMs assembly, chip underfill, sensor packaging, optical device sealing, fiber bundle potting for light guides or endoscopes, capacitor surface insulation coating, motor coil potting/insulation, and hard disk drive structural adhesive.
8218-H resists chemicals, water and moisture excellently after cure.
Curing Conditions:
| A/B Mix Ratio (by weight) | 10:1 |
|---|---|
| Recommended Cure Temperature and Time: | |
| 150℃ | 1 h |
| Suggested stepped ramp cure: | Complete all four stepped cure stages in order (standard properties may not be reached otherwise): |
| 80℃Cure Time | 30 min |
| 100℃Cure Time | 10 min |
| 120℃Cure Time | 5 min |
| 150℃Cure Time | 1 min |
| For the stepped cure above, recommended curing ovens: | Use FibKey HT-2010-P30 or HT-2020-P30 curing oven. The series programs up to 30 ramp segments freely and can be set horizontally or vertically. |
Specifications:
| Refractive Index @ 589.3nm | 1.572 |
|---|---|
| Specific Gravity 20/20℃ - Part “A” | 1.16 |
| Specific Gravity 20/20℃ - Part “B” | 1.03 |
| Shore Hardness | 85D |
| Viscosity (mixed), 25℃ | 2000-4000 cPs |
| Glass Transition Temp (Tg) | 110℃ |
| Decomposition Temperature | 400℃ |
| Adhesive Strength Al/Al | 230 kgf/cm² |
| CTE 50~100℃ | 54×μm/m/℃ |
| CTE 150~200℃ | 192×μm/m/℃ |
| Water Absorption 25℃, 24 h | 0.76% |
| Water Absorption 80℃, 24 h | 4.39% |
| Water Absorption 97℃, 1.5 h | 2.08% |
| Transmittance @ 550nm | > 50% |
| Transmittance @ 700-1000nm | > 98% |
| Transmittance @ 1100-1600nm | > 95% |
| Weight Loss @ 250℃ | < 0.05% |
| Weight Loss @ 300℃ | 0.16% |
| Weight Loss @ 350℃ | 1.59% |
| Thermal Conductivity | 0.3 w/mk |
| Dielectric Constant, 1KHz | 3.2 |
| Pot Life | 4 h |
| Shelf Life Unmixed (room temp, no refrigeration) | 1 year |
| Operating Temperature Range | -55~200℃ |
Storage:
Store at room temperature for 1 year. Close the lid after each use and store at room temperature. No refrigeration needed; do not store in a refrigerator. Below 5℃ the adhesive may crystallize, which is not a quality issue and does not affect performance. If crystals form, dissolve them before use. Contact us for detailed methods to dissolve crystals.